Title:
POLYIMIDE FILM FOR FLEXIBLE DISPLAY DEVICE SUBSTRATE HAVING EXCELLENT HEAT DISSIPATION CHARACTERISTICS
Document Type and Number:
WIPO Patent Application WO/2019/221364
Kind Code:
A1
Abstract:
The present invention can provide a substrate for a flexible display device, the substrate having a positive CTE value without deterioration in heat resistance even at a temperature of 350℃ or higher, by providing a polyimide obtained from the polymerization of polymerization elements in which p-PDA as a diamine is added in excess of s-BPDA as an acid dianhydride and a terminal sealant containing phthalic anhydride (PA) is added. In addition, such a manufacturing method allows the production of a polyimide film, which has higher transmittance than a polyimide film manufactured with a composition simply having an excess of a diamine, so that TFT devices can be fabricated through alignment keys more easily when the devices are fabricated on polyimide substrates.
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Inventors:
PARK JINYOUNG (KR)
KIM KYUNGHWAN (KR)
KIM KYUNGHWAN (KR)
Application Number:
PCT/KR2019/000639
Publication Date:
November 21, 2019
Filing Date:
January 16, 2019
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08J5/18; C08G73/10; C08L79/08; H01L51/00; H01L51/56
Foreign References:
| KR20140004655A | 2014-01-13 | |||
| KR20090084772A | 2009-08-05 | |||
| KR20170069190A | 2017-06-20 | |||
| KR20150046463A | 2015-04-30 | |||
| KR20180054983A | 2018-05-25 | |||
| KR20180164186A | 2018-12-18 |
Other References:
HUANG SEN-BIAO PROPERTIES: "Morphology and Structure of BPDA/PPD/TFMB Polyimide Fibers", CHEM. RES. CHINESE UNIVERSITIES, vol. 28, no. 4, 2012, pages 752 - 756, XP055654291
See also references of EP 3656805A4
See also references of EP 3656805A4
Attorney, Agent or Firm:
KIM, Aera (KR)
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