Title:
POLYIMIDE PRECURSOR COMPOSITION, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/080158
Kind Code:
A1
Abstract:
Provided is a polyimide precursor that is for producing a flexible electronic device substrate and that provides a polyimide that has reduced charge buildup and particularly has a film form. For this polyimide precursor, when a pair of electrodes 2a and 2b spaced apart from each other by an interval d are formed on a 10 μm-thick polyimide film 1 formed using the polyimide precursor, and the polyimide film is irradiated with a laser beam ω while a direct-current voltage is applied to the pair of electrodes such that a field intensity of 0.1-10 V/μm is achieved, two SHG beams 2ω observed between the electrodes exhibit a symmetry ratio of at least 0.5. Symmetry ratio (LR ratio) = Ismall/Ilarge, where Ilarge represents the peak intensity of the SHG beam having the higher intensity, and Ismall represents the peak intensity of the SHG beam having the lower intensity.
Inventors:
MIURA NORIO (JP)
HONMA SOUSUKE (JP)
INOUE SHOHEI (JP)
HISANO NOBUHARU (JP)
IIZUMI NOBU (JP)
MANAKA TAKAAKI (JP)
TAGUCHI DAI (JP)
HONMA SOUSUKE (JP)
INOUE SHOHEI (JP)
HISANO NOBUHARU (JP)
IIZUMI NOBU (JP)
MANAKA TAKAAKI (JP)
TAGUCHI DAI (JP)
Application Number:
PCT/JP2022/040991
Publication Date:
May 11, 2023
Filing Date:
November 02, 2022
Export Citation:
Assignee:
UBE CORP (JP)
International Classes:
C08G73/10; B32B17/10; B32B27/34; C08J5/18; H05K1/03
Domestic Patent References:
| WO2009107429A1 | 2009-09-03 | |||
| WO2014192561A1 | 2014-12-04 | |||
| WO2021054475A1 | 2021-03-25 | |||
| WO2019131884A1 | 2019-07-04 |
Foreign References:
| JP2019090047A | 2019-06-13 | |||
| JP2003192788A | 2003-07-09 | |||
| JP2020531663A | 2020-11-05 |
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
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