Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYIMIDE PRECURSOR, POLYIMIDE, AND FLEXIBLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/101984
Kind Code:
A1
Abstract:
Provided are: a polyimide precursor which is obtained by reacting a diamine with a tetracarboxylic acid dianhydride, contains 5-80 mol% of dimer diamine with respect to a diamine component contained in the polyimide precursor, and has a weight average molecular weight of 15,000-130,000; a polyimide obtained by curing the polyimide precursor; and a resin composition including the polyimide precursor.

More Like This:
JPH10512903INDUSTRIAL APPLICABILITY [Title of invention] Decolorization of porris succinimide
JP2006251478POSITIVE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION
JP2009114327HEAT-RESISTANT TRANSPARENT POLYIMIDE WITH OPTICAL ACTIVITY
Inventors:
MAENO TOMOAKI (JP)
KAWABATA YASUNORI (JP)
Application Number:
PCT/JP2020/041929
Publication Date:
May 19, 2022
Filing Date:
November 10, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G73/10
Foreign References:
JP2016188298A2016-11-04
JP2015526561A2015-09-10
JP2010256532A2010-11-11
JP2013155329A2013-08-15
JP2013112735A2013-06-10
JP2018140544A2018-09-13
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SAMPLE CLASSIFICATION METHOD

Next Patent: POWER SUPPLY DEVICE