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Title:
POLYIMIDE PRECURSOR RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/142866
Kind Code:
A1
Abstract:
This resin composition contains a solvent and a polyimide precursor having the structure represented by formula (1) {in the formula, R1 represents a divalent organic group and, when there is a plurality thereof, the R1's independently represent divalent organic groups; R2 represents a tetravalent organic group and, when there is a plurality thereof, the R2's independently represent tetravalent organic groups; n is a positive integer.}, wherein the weight average molecular weight of the polyimide precursor is 110,000 to 250,000 and the solids content of the resin composition is 10-25 mass%.

Inventors:
MAITANI, Masaki (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
SHINOHARA, Naoyuki (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
OGAWA, Keita (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
KANADA, Takayuki (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
OKUDA, Toshiaki (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
Application Number:
JP2019/001296
Publication Date:
July 25, 2019
Filing Date:
January 17, 2019
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
International Classes:
C08G73/10; B32B27/00
Domestic Patent References:
WO2015046019A12015-04-02
WO2016167296A12016-10-20
WO2014148441A12014-09-25
WO2017111299A12017-06-29
WO2015107990A12015-07-23
Foreign References:
JP2015202675A2015-11-16
JP2015052770A2015-03-19
JP2015072365A2015-04-16
JP2014074772A2014-04-24
JP2016037048A2016-03-22
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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