Title:
POLYIMIDE RESIN, RESIN COMPOSITION CONTAINING SAID POLYIMIDE RESIN, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/090348
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin material that has a novel structure and that can be suitably used in a printed wiring board; and a resin composition which contains this resin material and which yields a cured product having excellent heat resistance, dielectric properties, and adhesion to a metal foil or a substrate having low roughness. In order to achieve the foregoing, a polyimide resin is used, the polyimide resin being a copolymer of: an amino compound (A) containing a straight chain aliphatic diamino compound (a1), which has an amino group at both terminals, 1-4 methyl groups and/or ethyl groups in the side chains and 17-24 carbon atoms in the main chain, and an aromatic diamino compound (a2); and a tetrabasic acid dianhydride (B).
Inventors:
NISHIMURA KENGO (JP)
TANAKA RYUTARO (JP)
YAMAMOTO KAZUYOSHI (JP)
SASAKI CHIE (JP)
NAGASHIMA NORIYUKI (JP)
TANAKA RYUTARO (JP)
YAMAMOTO KAZUYOSHI (JP)
SASAKI CHIE (JP)
NAGASHIMA NORIYUKI (JP)
Application Number:
PCT/JP2022/042511
Publication Date:
May 25, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G73/10; C08L79/08
Domestic Patent References:
| WO2021049503A1 | 2021-03-18 |
Foreign References:
| JP2014051673A | 2014-03-20 | |||
| US2647146A | 1953-07-28 |
Attorney, Agent or Firm:
KAMIMURA, Yoichiro (JP)
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