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Title:
POLYIMIDE RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/058334
Kind Code:
A1
Abstract:
The present invention provides: a polyimide resin composition which contains a polyimide resin (A) that contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), with the content ratio of the repeating constituent unit represented by formula (1) to the total amount of the repeating constituent unit represented by formula (1) and the repeating constituent unit represented by formula (2) being 20% by mole to 70% by mole, and an amorphous resin (B) that contains a repeating constituent unit represented by formula (I); and a molded body which contains this polyimide resin composition. (In the formulae, R1 represents a divalent group which comprises at least one alicyclic hydrocarbon structure, while having 6 to 22 carbon atoms; R2 represents a divalent chain aliphatic group which has 5 to 16 carbon atoms; and each of X1 and X2 independently represents a tetravalent group which comprises at least one aromatic ring, while having 6 to 22 carbon atoms.)

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Inventors:
SAKAI ATSUSHI (JP)
SATO YUUKI (JP)
FUKUSHIMA TAKUYA (JP)
Application Number:
PCT/JP2022/031146
Publication Date:
April 13, 2023
Filing Date:
August 18, 2022
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L79/08; C08G73/10; C08L81/06
Domestic Patent References:
WO2016147996A12016-09-22
WO2021131501A12021-07-01
WO2019220969A12019-11-21
WO2022065063A12022-03-31
WO2016147996A12016-09-22
Foreign References:
JP2017132892A2017-08-03
JPH10251515A1998-09-22
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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