Title:
POLYIMIDE RESIN COMPOSITION, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2021/070912
Kind Code:
A1
Abstract:
A polyimide resin composition which contains a polyimide resin and a crosslinking agent that has at least two oxazolyl groups, wherein: the polyimide resin has constituent units A derived from a tetracarboxylic acid dianhydride and constituent units B derived from a diamine; and the constituent units B include constituent units (B-1) derived from a diamine that has a sulfonyl group in the structure and constituent units (B-2) derived from a specific compound typified by 3, 5-DABA.
Inventors:
HOSHINO SHUN (JP)
WAKITA NATSUMI (JP)
MITADERA JUN (JP)
WAKITA NATSUMI (JP)
MITADERA JUN (JP)
Application Number:
PCT/JP2020/038171
Publication Date:
April 15, 2021
Filing Date:
October 08, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08K5/353; C08L79/08
Domestic Patent References:
| WO2016158825A1 | 2016-10-06 | |||
| WO2014148441A1 | 2014-09-25 | |||
| WO2019151336A1 | 2019-08-08 | |||
| WO2019188305A1 | 2019-10-03 |
Foreign References:
| JP2016222797A | 2016-12-28 |
Other References:
IMAI ET AL.: "Latest polyimide-basics and applications", 28 January 2002 (2002-01-28), pages 140 - 143
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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