Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYIMIDE RESIN AND METHOD FOR PRODUCING SAME, AND POLYIMIDE FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/246466
Kind Code:
A1
Abstract:
This polyimide resin has an acid dianhydride-derived structure and a diamine-derived structure, contains 40-100 mol% of a fluoroalkyl-substituted benzidine, as a diamine, with respect to a total of 100 mol% of the diamine, and contains, as an acid dianhydride, 40-85 mol% of an acid dianhydride represented by general formula (1) and 15-60 mol% of an acid dianhydride having a cyclobutane structure, with respect to a total of 100 mol% of the acid dianhydride. In general formula (1), R1-R8 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a perfluoro alkyl group having 1 to 20 carbon atoms, and at least one among R1-R4 and at least one among R5-R8 are an alkyl group having 1 to 20 carbon atoms, or a perfluoro alkyl group having 1 to 20 carbon atoms.

Inventors:
USHIRO HIROYUKI (JP)
OGAWA KOHEI (JP)
MIYAMOTO MASAHIRO (JP)
Application Number:
PCT/JP2020/021778
Publication Date:
December 10, 2020
Filing Date:
June 02, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
WO2014046180A12014-03-27
WO2018088543A12018-05-17
WO2018180926A12018-10-04
WO2017169651A12017-10-05
Foreign References:
JP2018087260A2018-06-07
JP2018193343A2018-12-06
JP2018028052A2018-02-22
JP2019001989A2019-01-10
Attorney, Agent or Firm:
SHINTAKU, Masato (JP)
Download PDF: