Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/246467
Kind Code:
A1
Abstract:
A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of the roughened surface is 1.0-8.5 μm inclusive, and the root mean square height Sq is 0.10-0.98 μm inclusive.
Inventors:
TAKAZAWA RYOJI (JP)
SATO AKIRA (JP)
NAKASAKI RYUSUKE (JP)
SATO AKIRA (JP)
NAKASAKI RYUSUKE (JP)
Application Number:
PCT/JP2020/021782
Publication Date:
December 10, 2020
Filing Date:
June 02, 2020
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; C25D1/00; C25D1/04; C25D5/12; C25D5/16; C25D5/48; H05K1/09
Domestic Patent References:
| WO2018047933A1 | 2018-03-15 | |||
| WO2018198905A1 | 2018-11-01 | |||
| WO2014081041A1 | 2014-05-30 |
Foreign References:
| JP2018172785A | 2018-11-08 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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