Title:
POLYMER, HYDROGEN ADDITIVE, RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO2010110323
Kind Code:
A1
Abstract:
Provided is a polymer comprising a monomer polymerization unit represented by the general formula (1); whereby, a polymer that is highly soluble in solar solvents, exhibits low water absorption, and has a strong adherence to substrates, a hydrogen additive of said polymer, a resin composition using said polymer and/or said hydrogen additive, a resin film formed out of said resin composition, and an electronic component having said resin film can be obtained.
Inventors:
GOTO KUNIHIRO (JP)
Application Number:
PCT/JP2010/055095
Publication Date:
September 30, 2010
Filing Date:
March 24, 2010
Export Citation:
Assignee:
ZEON CORP (JP)
GOTO KUNIHIRO (JP)
GOTO KUNIHIRO (JP)
International Classes:
C08F32/04; C08G61/12; C08L65/00; G02B1/04; H01L21/312
Foreign References:
| KR20100009996A | 2010-01-29 | |||
| FR1594934A | 1970-06-08 |
Other References:
C. T. VIJAYAKUMAR ET AL.: "Structural aspects of polyimides. I. Polymerization and degradation of endo-N- phenylnadimide and endo-N-isobutylnadimide", JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY, vol. 27, no. 8, 1989, pages 2723 - 2748
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
It can exceed and is a patent business corporation. (JP)
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