Title:
POLYMER AND POSITIVE RESIST COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/132727
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polymer in which poisoning is suppressed and which can be satisfactorily used as a positive resist in which the unexposed portions have fully ensured resistance to being dissolved by developer solution, and to provide a positive resist composition which can efficiently form a high-resolution resist pattern. The polymer contains an α-methylstyrene unit and an α-chloro-methyl acrylate unit, the molecular weight distribution (Mw/Mn) is less than 1.25, and the proportion of components that have a molecular weight of less than 6000 exceeds 0.5% and is less than or equal to 5.0%. Further, this positive resist composition contains the aforementioned polymer and a solvent.
Inventors:
HOSHINO MANABU (JP)
Application Number:
PCT/JP2016/000772
Publication Date:
August 25, 2016
Filing Date:
February 15, 2016
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F212/06; C08F220/22; G03F7/039; G03F7/20
Foreign References:
| JP2016012104A | 2016-01-21 |
Other References:
T. YAMAGUCHI ET AL.: "Molecular weight effect on line -edge roughness", PROCEEDINGS OF SPIE, vol. 5039, 2013, pages 1212 - 1219
KATSUYA OKUBO ET AL.: "Cho Bisai Kako-yo Denshisen Polymer Resist no Kaihatsu to Hyoka", POLYMER MATERIAL FORUM KOEN YOKOSHU, vol. 21, 2012, pages 38
KATSUYA OKUBO ET AL.: "Cho Bisai Kako-yo Denshisen Polymer Resist no Kaihatsu to Hyoka", POLYMER MATERIAL FORUM KOEN YOKOSHU, vol. 21, 2012, pages 38
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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