POLYMER, RESIST COMPOSITION CONTAINING SAID POLYMER, METHOD FOR MANUFACTURING MEMBER USING SAME, PATTERN FORMATION METHOD, AND METHOD FOR FORMING REVERSAL PATTERN

WIPO Patent Application WO/2020/170555

A1

Provided are: a polymer used in a resist composition which has high absorption efficiency and which is superior in the characteristics of sensitivity, resolution, and pattern performance, and whereby the effects of decreased sensitivity and worsening of pattern roughness that occur due to a decrease in energy application density are mitigated in patterning formed by particles and irradiation with electromagnetic waves or a particle beam having high photon energy; a resist composition containing the polymer; and a method for manufacturing a member using the polymer and the resist composition.　The polymer includes: units A having an onium salt structure which is decomposed by irradiation with a particle beam, electromagnetic waves, or the like and undergoes polarity conversion due to conversion from an ionic to a non-ionic state, and also simultaneously generates a radical and an acid; and units B having a structure which bonds by an acid-catalyzed reaction. The units B are preferably units in which a compound represented by general formula (I) or (II) is bonded with an Sp group of formula (1) at any position in the compound.

ENOMOTO SATOSHI (JP)
KOZAWA TAKAHIRO (JP)
MACHIDA KOHEI (JP)
NAITO MICHIYA (JP)

PCT/JP2019/047919

August 27, 2020

December 06, 2019

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TOYO GOSEI CO LTD (JP)
UNIV OSAKA (JP)

C08F220/38; G03F7/004; G03F7/038; G03F7/20

WO2017057537A1	2017-04-06
WO2015025665A1	2015-02-26

JP2017207532A	2017-11-24
JPS5376825A	1978-07-07

SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)

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