Title:
POLYMERIZABLE COMPOSITION, ADHESIVE, MOLECULE-BLOCKING FILM, AND PROTECTIVE SHEET FOR SOLAR CELL MODULE
Document Type and Number:
WIPO Patent Application WO/2011/040490
Kind Code:
A1
Abstract:
Provided is a polymerizable composition which is a material for a film that imparts high molecule-blocking properties. The polymerizable composition comprises a lamellar compound (A), a solvent or dispersion medium (B) which has a boiling point lower than 150ºC at ordinary pressure, and a polymerizable compound (C) having a boiling point of 150ºC or higher at ordinary pressure, the ratio of the lamellar compound (A) to the polymerizable compound (C) being in the range of from 50:50 to 90:10 (by mass). The polymerizable compound (C) is a radical-polymerizable compound (C-1) or a cationically polymerizable compound (C-2).
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Inventors:
WATANABE JUN (JP)
HOSINO YUKIHISA (JP)
HOSINO YUKIHISA (JP)
Application Number:
PCT/JP2010/066989
Publication Date:
April 07, 2011
Filing Date:
September 29, 2010
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
WATANABE JUN (JP)
HOSINO YUKIHISA (JP)
WATANABE JUN (JP)
HOSINO YUKIHISA (JP)
International Classes:
C08F2/44; B32B27/20; B32B27/30; C08G59/68; C09J4/02; C09J7/02; C09J109/00; H01L31/042
Foreign References:
| JP2005162868A | 2005-06-23 | |||
| JPH1160983A | 1999-03-05 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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