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Patent Searching and Data


Title:
POLYMERIZABLE COMPOSITION, PHOTOCURABLE ADHESIVE AGENT, CURED PRODUCT MANUFACTURING METHOD, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/210595
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polymerizable composition with which it is possible to manufacture a cured product having excellent resistance to moist heat. The present invention is a polymerizable composition containing a thioether compound (A), a cation-polymerizable compound (B), and a cationic polymerization initiator (C). The thioether compound (A) preferably includes an ester bond in the molecule. The polymerizable composition preferably contains the thioether compound (A) in an amount not less than 0.1 parts by mass but less than 10 parts by mass with respect to 100 parts by mass of the cation-polymerizable compound (B).

Inventors:
INOUE TAKAHIRO (JP)
ITANO KAZUYUKI (JP)
MATSUDO KAZUHIKO (JP)
Application Number:
PCT/JP2022/015169
Publication Date:
October 06, 2022
Filing Date:
March 28, 2022
Export Citation:
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Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/68; C08G59/02; C09J163/00; C09J201/00
Foreign References:
JP2003096185A2003-04-03
JPH11116929A1999-04-27
JP2006016411A2006-01-19
JP2005120190A2005-05-12
CN108546536A2018-09-18
JP2006124636A2006-05-18
JP2010285463A2010-12-24
JP2008266531A2008-11-06
JP2013023559A2013-02-04
JP6513281B22019-05-15
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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