Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2001/048084
Kind Code:
A1
Abstract:
A polyoxymethylene resin composition comprising (A) 100 parts by weight of a polyoxymethylene resin, (B) 0.01 to 5 parts by weight of at least one polymer selected from the group consisting of homopolymers of N-vinylated carboxylic acid amides and copolymers thereof with other vinyl monomers and (C) 0.01 to 5 parts by weight of at least one compound selected from the group consisting of polyalkylene glycols and derivatives thereof, fatty acid amides, esters of fatty acids with alcohols, and esters of dicarboxylic acids with alcohols. This composition little generates formaldehyde gas in the production or molding thereof, is protected from scorching, and can give moldings extremely excellent in resistances to water and repeated impact.
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Inventors:
SEYAMA TOSHIHARU (JP)
HORIO MITSUHIRO (JP)
HORIO MITSUHIRO (JP)
Application Number:
PCT/JP2000/009249
Publication Date:
July 05, 2001
Filing Date:
December 26, 2000
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
SEYAMA TOSHIHARU (JP)
HORIO MITSUHIRO (JP)
SEYAMA TOSHIHARU (JP)
HORIO MITSUHIRO (JP)
International Classes:
C08K5/06; C08K5/10; C08K5/103; C08K5/20; C08L59/00; C09D11/00; (IPC1-7): C08L59/00; C08K5/05; C08K5/10; C08K5/20
Foreign References:
| JPH08311302A | 1996-11-26 | |||
| EP0658599A1 | 1995-06-21 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1 Ohtemachi 2-chome Chiyoda-ku, Tokyo, JP)
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