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Title:
POROUS MATERIAL AND HONEYCOMB STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/146954
Kind Code:
A1
Abstract:
Provided are a porous material having high thermal shock resistance, and a honeycomb structure. The porous material contains a main aggregate and an auxiliary aggregate as aggregates. The main aggregate is silicon carbide particles; the auxiliary aggregate is at least either mullite particles or alumina particles; the aggregates are bonded via a bonding phase, so as to form pores; the bonding phase is at least either a non-crystalline phase or a cordierite phase; and the porosity is 40%-90%. The honeycomb structure is configured using this kind of porous material, and comprising partition walls that segment and form a plurality of cells extending from one end surface to the other end surface.

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Inventors:
IZUMI YUNIE (JP)
KOBAYASHI YOSHIMASA (JP)
Application Number:
PCT/JP2013/059144
Publication Date:
October 03, 2013
Filing Date:
March 27, 2013
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
B01D39/20; C04B38/00; B01D46/00; B01D53/86; B01J27/224; B01J35/04; B01J35/10; C04B35/622; F01N3/021
Foreign References:
JP4227347B22009-02-18
JP2003176185A2003-06-24
JP2010502546A2010-01-28
JP4111439B22008-07-02
JP4227347B22009-02-18
JPH07315933A1995-12-05
Other References:
See also references of EP 2832713A4
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)
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