Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND PARTITION WALL OF ORGANIC ELECTROLUMINESCENT ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/246445
Kind Code:
A1
Abstract:
Provided is a highly photosensitive resin composition which is capable of forming a pattern having a high resolution and contains a black colorant. A positive photosensitive resin composition according to an embodiment contains (A) an acrylic resin having a plurality of phenolic hydroxyl groups at least a portion of which is protected by an acid-labile group, (B) at least one black colorant selected from the group consisting of black dyes and black pigments, and (C) a quinonediazide compound as a photoacid generator.
Inventors:
FURUE KENTARO (JP)
ARAI YOSHIKAZU (JP)
ARAI YOSHIKAZU (JP)
Application Number:
PCT/JP2021/021033
Publication Date:
December 09, 2021
Filing Date:
June 02, 2021
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G03F7/039; H01L51/50; H05B33/02; H05B33/12; H05B33/22
Domestic Patent References:
| WO2016136752A1 | 2016-09-01 |
Foreign References:
| JP2018180151A | 2018-11-15 | |||
| JP2019001007A | 2019-01-10 | |||
| JPH1020489A | 1998-01-23 | |||
| JP2017107024A | 2017-06-15 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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