Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/069172
Kind Code:
A1
Abstract:
Provided is a positive photosensitive resin composition having high sensitivity, high definition, and high adhesiveness and being capable of maintaining blackness and high light-blocking properties, even after a high-temperature curing step, e.g., at 250°C. This positive photosensitive resin composition contains: a binder resin (A); a quinonediazide compound (B); and at least one type of black dye (C) selected from black dyes specified by the color indexes of solvent black 27-47. The black dye (C) is ideally specified by the color index of solvent black 27, 29, or 34. This composition is capable of being suitably used in positive radiation lithography and can be used to form organic EL element partitions and insulating films.
Inventors:
FURUE KENTARO (JP)
MIYAISHI YUKI (JP)
MIYAISHI YUKI (JP)
Application Number:
PCT/JP2016/081012
Publication Date:
April 27, 2017
Filing Date:
October 19, 2016
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G03F7/023; H01L51/50; H05B33/10; H05B33/22
Foreign References:
| US20130164461A1 | 2013-06-27 | |||
| JPS5619055A | 1981-02-23 | |||
| US4307173A | 1981-12-22 | |||
| JP2015145912A | 2015-08-13 | |||
| JP2014137523A | 2014-07-28 | |||
| JP2007156243A | 2007-06-21 | |||
| JP2010237310A | 2010-10-21 | |||
| JP2007256646A | 2007-10-04 | |||
| JP2011209692A | 2011-10-20 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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