Title:
POSITIVE-TYPE PHOTORESIST COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/063635
Kind Code:
A1
Abstract:
Provided is a positive-type photoresist composition characterized by comprising (A) a cresol novolak resin produced using m-cresol, p-cresol and formaldehyde as the essential raw materials and (B) a novolak-type phenol resin produced using o-cresol, resorcinol and formaldehyde as the essential raw materials. This positive-type photoresist composition can combine, at a high level, sensitivity and heat resistance, which have been difficult to combine in the past. Thus, the positive-type photoresist composition can be suitably used as a resist in the production of articles which necessitate the formation of finer patterns owing to the recent increase in the degree of integration, said articles including semiconductor devices such as IC and LSI, display devices such as LCD, and printing plate precursors.
Inventors:
KAGE TAKAKAZU (JP)
IMAIZUMI NORIFUMI (JP)
IMAIZUMI NORIFUMI (JP)
Application Number:
PCT/JP2011/074489
Publication Date:
May 18, 2012
Filing Date:
October 25, 2011
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
KAGE TAKAKAZU (JP)
IMAIZUMI NORIFUMI (JP)
KAGE TAKAKAZU (JP)
IMAIZUMI NORIFUMI (JP)
International Classes:
G03F7/023; C08G61/12
Domestic Patent References:
| WO2005010112A1 | 2005-02-03 |
Foreign References:
| JP2010039237A | 2010-02-18 | |||
| JP2009040899A | 2009-02-26 | |||
| JPS60159846A | 1985-08-21 | |||
| JPH11258808A | 1999-09-24 |
Other References:
See also references of EP 2639637A4
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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Claims: