Title:
POWER AMPLIFIER MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/215041
Kind Code:
A1
Abstract:
Provided are a power amplifier module and a communication device having reduced size. A power amplifier module (100) comprises a mounting substrate (200), a power amplifier (80), and an attenuating circuit (such as a first attenuating circuit 61) for attenuating harmonics of a signal output from the power amplifier (80). The attenuating circuit comprises a plurality of inductors (a first inductor 612, a second inductor 613) which are stacked inside the mounting substrate (200) and are connected to an output terminal (81) of the power amplifier (80). The plurality of inductors are disposed so as to overlap when the mounting substrate (200) is viewed in plan from a thickness direction (D1).
Inventors:
TOYOMURA TAKAHISA
TAKEMATSU YUJI
TAKEMATSU YUJI
Application Number:
PCT/JP2020/045528
Publication Date:
October 28, 2021
Filing Date:
December 07, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/01; H03F3/24; H04B1/00; H04B1/03; H04B1/04
Domestic Patent References:
| WO2019240096A1 | 2019-12-19 |
Foreign References:
| JP2018032951A | 2018-03-01 | |||
| JP2007129565A | 2007-05-24 | |||
| JP2018064266A | 2018-04-19 | |||
| JP2017208729A | 2017-11-24 | |||
| JP2007158748A | 2007-06-21 | |||
| JP2008211764A | 2008-09-11 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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