Title:
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/135221
Kind Code:
A1
Abstract:
The present invention addresses the problem of improving sticking force or adhesive force between an insulating sheet and a coating material, preventing separation of the insulating sheet and the coating material, and improving insulation reliability. A power semiconductor device of the present invention is provided with: a circuit body having a power semiconductor element; a cooling body opposing the circuit body; an insulating sheet which is disposed in a space between the circuit body and the cooling body and which contains an inorganic filler; and a coating material contacting the circuit body, the cooling body, and the insulating sheet. When viewed from a direction perpendicular to a contact surface between the circuit body and the insulating sheet, the insulating sheet has a side formed smaller than the circuit body and the cooling body, wherein the side of the insulating sheet is formed in an irregular shape such that the coating material can be embedded therein.
Inventors:
KUSUKAWA JUNPEI (JP)
TSUYUNO NOBUTAKE (JP)
TOKUYAMA TAKESHI (JP)
MATSUSHITA AKIRA (JP)
SATOH TOSHIYA (JP)
TSUYUNO NOBUTAKE (JP)
TOKUYAMA TAKESHI (JP)
MATSUSHITA AKIRA (JP)
SATOH TOSHIYA (JP)
Application Number:
PCT/JP2017/045675
Publication Date:
July 26, 2018
Filing Date:
December 20, 2017
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L23/36; H01L23/373; H01L25/07; H01L25/18
Domestic Patent References:
| WO2017110614A1 | 2017-06-29 |
Foreign References:
| JP2014123644A | 2014-07-03 | |||
| JP2017135310A | 2017-08-03 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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