Title:
PREFORM MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/225062
Kind Code:
A1
Abstract:
The purpose of the present invention is to manufacture a hollow molded body in which whitening does not occur in a gate part and which is free from stringiness in such a manner that a preform capable of being blow-molded is properly divided between a resin portion of the gate part and a resin portion on a heat insulation sheet side of the preform to allow mold release by a preform molding device in which a disc-shaped heat insulation sheet having a simple shape is held between a circular-hole-shaped concave part on a cavity mold side and a tip end of a hot runner nozzle that is inserted into the circular-hole-shaped concave part. The thickness of a heat insulation sheet 13 is set at a thickness at which a resin melting layer 20 and a resin heat insulation layer 21 are formed in an opening 16 of the heat insulation sheet 13, and the circular opening of the opening 16 is set at a width at which a resin in the resin heat insulation layer 21 that performs heat exchange with the resin melting layer 20 is allowed to come in contact with an inter-concave part top surface 10 of a circular-hole-shaped concave part 6 of a cavity mold 5 and perform heat exchange to maintain a solidified state.
Inventors:
MACHIDA TOSHIHIRO (JP)
Application Number:
PCT/JP2019/003323
Publication Date:
November 28, 2019
Filing Date:
January 31, 2019
Export Citation:
Assignee:
AOKI TECHNICAL LABORATORY INC (JP)
International Classes:
B29C45/26
Domestic Patent References:
| WO2017002150A1 | 2017-01-05 |
Foreign References:
| JP2000351151A | 2000-12-19 | |||
| JP2002361691A | 2002-12-18 | |||
| JP2004059129A | 2004-02-26 | |||
| JPH06254928A | 1994-09-13 |
Attorney, Agent or Firm:
AKIMOTO Teruo et al. (JP)
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