Title:
PREPARATION METHOD FOR COMPOSITE DIELECTRIC COPPER-CLAD SUBSTRATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/007004
Kind Code:
A1
Abstract:
A preparation method for a composite dielectric copper-clad substrate, and a printed circuit board. The preparation method comprises: forming a substrate green body by means of an emulsion of a fluorine-containing material and at least two types of ceramic filler materials, the total amount of the fluorine-containing material and the at least two types of ceramic filler materials being 100 parts by weight, the amount of the fluorine-containing material being 20-60 parts by weight, the at least two types of ceramic filler materials comprising a first ceramic filler material and a second ceramic filler material, the amount of the first ceramic filler material being 1-5 parts by weight, and the amount of the second ceramic filler material being 40-70 parts by weight; performing pre-sintering treatment on the substrate green body to form a composite substrate; and performing vacuum sintering on the composite substrate at a preset sintering temperature and a preset hot pressing pressure to form a composite dielectric copper-clad substrate, the preset sintering temperature being higher than the melting point of the fluorine-containing material and lower than the decomposition temperature of the fluorine-containing material, and the preset hot pressing pressure ranging from 5 MPa to 20 MPa. By means of the implementation method, the coefficient of thermal expansion of the composite dielectric copper-clad substrate can be effectively reduced to be equivalent to that of a copper foil.
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Inventors:
HUANG GUOCHUANG (CN)
WANG HEZHI (CN)
WANG HEZHI (CN)
Application Number:
PCT/CN2020/103897
Publication Date:
January 13, 2022
Filing Date:
July 23, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (SG)
AAC TECHNOLOGIES PTE LTD (SG)
International Classes:
H05K3/02; H05K1/02; H05K1/03; H05K3/00
Foreign References:
| CN107746272A | 2018-03-02 | |||
| CN108943779A | 2018-12-07 | |||
| CN102504451A | 2012-06-20 | |||
| CN108570202A | 2018-09-25 | |||
| CN108901130A | 2018-11-27 | |||
| CN107474312A | 2017-12-15 | |||
| US4335180A | 1982-06-15 |
Attorney, Agent or Firm:
SHENZHEN ZICHEN INTELLECTUAL PROPERTY AGENCY LIMITED (CN)
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