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Patent Searching and Data


Title:
PREPARATION METHOD FOR MICROCAPSULE FOR SELF-REPAIRING MATERIAL WITH PHENOLIC RESIN AS WALL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/194561
Kind Code:
A1
Abstract:
Provided are a microcapsule for a self-repairing material with a phenolic resin as a wall material and a preparation method thereof. The wall material of the microcapsule is a cross-linking cured phenolic resin and the core material is dicyclopentadiene. The preparation method for the microcapsule comprises the following steps: preparing a resol thermosetting resin to obtain a reaction liquid; preparing a core material emulsion; mixing the core material emulsion with the reaction liquid at 60-65°C to obtain a mixing solution; adjusting the pH value of the mixing solution to 2.5-1; increasing the temperature to 70-80°C and reacting for 1.5-2 hours; then increasing the temperature to 85-90°C and reacting for 1.5-2 hours, so as to obtain a microcapsule precipitate; filtrating same by suction and drying at 40-60°C, so as to obtain the microcapsule for a self-repairing material with a phenolic resin as the wall material.

Inventors:
ZHU GUANGMING (CN)
CHEN GUANJIN (CN)
TANG JIAONING (CN)
DONG BIQIN (CN)
WANG XIANFENG (CN)
HAN NINGXU (CN)
XING FENG (CN)
Application Number:
PCT/CN2013/080951
Publication Date:
December 11, 2014
Filing Date:
August 07, 2013
Export Citation:
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Assignee:
UNIV SHENZHEN (CN)
International Classes:
B01J13/02
Foreign References:
CN1927187A2007-03-14
CN101249409A2008-08-27
CN102618223A2012-08-01
CN1927445A2007-03-14
CN101671440A2010-03-17
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY OFFICE (CN)
深圳市恒申知识产权事务所(普通合伙) (CN)
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