Title:
EPOXY MICROCAPSULE AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/194560
Kind Code:
A1
Abstract:
The present invention is applicable to the field of microcapsule preparation and self-repairing materials. Provided is an epoxy resin microcapsule. The epoxy resin microcapsule comprises a capsule core and a capsule wall, wherein the capsule core consists of an epoxy resin or a mixture containing an epoxy resin; the capsule wall is obtained through a reaction between a part of the epoxy resin from the capsule core and a curing agent. The invention also provides a preparation method for the epoxy resin microcapsule. The preparation method of the epoxy resin microcapsule provided in the invention has a simple process.
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Inventors:
ZHU GUANGMING (CN)
ZHOU YUMING (CN)
TANG JIAONING (CN)
DONG BIQIN (CN)
WANG XIANFENG (CN)
HAN NINGXU (CN)
XING FENG (CN)
ZHOU YUMING (CN)
TANG JIAONING (CN)
DONG BIQIN (CN)
WANG XIANFENG (CN)
HAN NINGXU (CN)
XING FENG (CN)
Application Number:
PCT/CN2013/080880
Publication Date:
December 11, 2014
Filing Date:
August 06, 2013
Export Citation:
Assignee:
UNIV SHENZHEN (CN)
International Classes:
C08G59/50; B01J13/02; C08L63/00
Domestic Patent References:
| WO2005054393A1 | 2005-06-16 |
Foreign References:
| JP2003194032A | 2003-07-09 | |||
| CN101319055A | 2008-12-10 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY OFFICE (CN)
深圳市恒申知识产权事务所（普通合伙） (CN)
深圳市恒申知识产权事务所（普通合伙） (CN)
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