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Title:
PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/122819
Kind Code:
A1
Abstract:
The present invention pertains to: a prepreg containing two or more fiber substrate layers and one or more resin composition layers, wherein at least one of the one or more resin composition layers has a fiber substrate layer on both surfaces thereof; a printed circuit board that uses the prepreg; a method for producing the printed circuit board; and a semiconductor package.

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Inventors:
TOSAKA YUJI (JP)
SAITOH TAKESHI (JP)
NAKAMURA YUKIO (JP)
SASAKI RYOHTA (JP)
SHIMIZU HIROSHI (JP)
Application Number:
PCT/JP2017/001133
Publication Date:
July 20, 2017
Filing Date:
January 13, 2017
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B29B11/16; B32B5/28; B32B15/08; H05K1/03; B29K101/10
Foreign References:
JP2012240348A2012-12-10
JP2012231140A2012-11-22
JP2009212224A2009-09-17
JP2014208457A2014-11-06
JP2011068138A2011-04-07
Other References:
See also references of EP 3403800A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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