Title:
PRESS-FORMING DEVICE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/035915
Kind Code:
A1
Abstract:
Provided is a press-forming device capable of carrying out press-forming while cooling a heated workpiece. The press-forming device may be equipped with a first die for supporting the workpiece. The press-forming device may be equipped with a second die arranged opposing the first die. The first die may have a punch having a first forming surface for forming the workpiece. The first die may have a blank holder that is arranged so as to be movable along a side surface extending from the first forming surface of the punch, and that has a support surface supporting an end portion of the workpiece. The second die may have a die portion having a second forming surface that opposes the first forming surface and is for forming the workpiece. The second die may have a trim portion formed integrally with the die portion. The trim portion may have a blade part for cutting the end portion of the workpiece. The die portion may have a circulation passage along the second forming surface for circulating a coolant for cooling the workpiece.
Inventors:
SERIZAWA TSUTOMU (JP)
OHBUCHI KOJI (JP)
KIKAWA TAMIYA (JP)
MIAO DIYUN (JP)
OHBUCHI KOJI (JP)
KIKAWA TAMIYA (JP)
MIAO DIYUN (JP)
Application Number:
PCT/JP2018/030347
Publication Date:
February 20, 2020
Filing Date:
August 15, 2018
Export Citation:
Assignee:
UNIPRES CORP (JP)
International Classes:
B21D37/16; B21D5/01; B21D24/00; B21D28/00
Foreign References:
| JP6256571B1 | 2018-01-10 | |||
| JP5827621B2 | 2015-12-02 | |||
| JP6157845B2 | 2017-07-05 | |||
| JP2016182642A | 2016-10-20 | |||
| JPH0644486Y2 | 1994-11-16 | |||
| JPS6256571B2 | 1987-11-26 |
Other References:
"Press Technology", vol. 52, August 2014, NIKKAN KOGYO SHIMBUN,LTD, article "Special feature: Latest technological trends in hot stamping to be in full swing] Development of a manufacturing method for in-die trim in hot stamp (hot stamping", pages: 22,23
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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