Title:
PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/208378
Kind Code:
A1
Abstract:
The pressure-sensitive adhesive film (100) of the present invention is for use in processing an electronic component, and comprises a base layer (10), an irregularity-absorbing resin layer (20), and a pressure-sensitive adhesive resin layer (30) in this order, wherein the irregularity-absorbing resin layer (20) includes a thermoplastic resin and has a melting point (Tm), as measured with a differential scanning calorimeter (DSC), in the range of 10-50°C. The electronic component has a circuit formation surface, and the pressure-sensitive adhesive film is used for grinding the surface of the electronic component on the reverse side from the circuit formation surface so that the thickness of the electronic component is reduced to 250 μm or less.
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KURIHARA HIROYOSHI (JP)
Application Number:
PCT/JP2019/016599
Publication Date:
October 31, 2019
Filing Date:
April 18, 2019
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J7/29; B32B27/00; B32B27/32; C09J201/00; H01L21/304
Domestic Patent References:
| WO2015064574A1 | 2015-05-07 |
Foreign References:
| JP2000038556A | 2000-02-08 | |||
| JP2013087131A | 2013-05-13 | |||
| JP2009132867A | 2009-06-18 | |||
| JP2018006541A | 2018-01-11 | |||
| JP2014175334A | 2014-09-22 | |||
| JP2000017239A | 2000-01-18 | |||
| JP2014011273A | 2014-01-20 | |||
| JP2010258426A | 2010-11-11 | |||
| JP2018083419A | 2018-05-31 |
Other References:
See also references of EP 3786246A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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