PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT

Title:

PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2023/053537

Kind Code:

A1

Abstract:

Provided is a pressure-sensitive adhesive sheet for temporarily fixing electronic components to supports which becomes removable from the supports upon irradiation with laser light and which can be made to leave little residue on the supports after the removal.　This pressure-sensitive adhesive sheet for temporarily fixing electronic components includes a photothermal conversion layer and a pyrolysis layer directly disposed on the photothermal conversion layer, wherein the pyrolysis layer has a lower 5% weight loss temperature through ultraviolet irradiation than the photothermal conversion layer.

Inventors:

UENO SHUSAKU (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)

Application Number:

PCT/JP2022/015755

Publication Date:

April 06, 2023

Filing Date:

March 30, 2022

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

C09J7/38; C09J7/20; H01L21/301; H01L21/304; C09J133/04

Domestic Patent References:

WO2013145036A1	2013-10-03
WO2017065188A1	2017-04-20

Foreign References:

JP4565804B2	2010-10-20
JP2016500918A	2016-01-14

Attorney, Agent or Firm:

MOMII Takafumi (JP)

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