Title:
PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARY FIXING ELECTRONIC COMPONENT AND PROCESSING METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/053538
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive sheet used for temporarily fixing an electronic component to a support, the adhesive sheet exhibiting releasability from the support under laser light irradiation, and enabling the reduction in residue on the support after the release. The pressure-sensitive adhesive sheet for temporarily fixing an electronic component of the present invention comprises a photothermal conversion layer and a thermal decomposition layer directly disposed on the photothermal conversion layer, wherein the 5% weight loss temperature of the thermal decomposition layer is lower than the 5% weight loss temperature of the photothermal conversion layer. In one embodiment, the photothermal conversion layer has a 5% weight loss temperature of 300-600°C.
Inventors:
UENO SHUSAKU (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2022/015756
Publication Date:
April 06, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J7/20; H01L21/301; H01L21/304; C09J133/04
Domestic Patent References:
| WO2013145036A1 | 2013-10-03 | |||
| WO2017065188A1 | 2017-04-20 |
Foreign References:
| JP4565804B2 | 2010-10-20 | |||
| JP2016500918A | 2016-01-14 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
Download PDF: