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Patent Searching and Data


Title:
PRESSURE-SENSITIVE ADHESIVE AND/OR ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/100861
Kind Code:
A1
Abstract:
The present invention provides a pressure-sensitive adhesive and/or an adhesive which can be more flexibly changed by an external stimulus at an arbitrary timing. Provided is a release liner-equipped pressure-sensitive adhesive sheet and/or adhesive sheet 10 comprising: a pressure-sensitive adhesive layer and/or adhesive layer 1 that includes the following component (a) and component (b); and a release liner 2. Component (a): a polymer that has, in the molecule thereof, a reversibly degradable bond which can be split by an external stimulus and then re-bond thereafter, and/or a compound capable of introducing the reversibly degradable bond into a polymer. Component (b): a compound that inhibits the re-bonding.

Inventors:
TOBINAGA SHUN (JP)
NAKANO TAKESHI (JP)
IWATA SATOSHI (JP)
Application Number:
PCT/JP2022/043957
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J7/38; C09J133/04; C09J163/00; C09J201/00
Domestic Patent References:
WO2022075366A12022-04-14
Other References:
MIYAMOTO. YUKI ET AL.: "Development of Photo-Melt Resin", JOURNAL OF NETWORKPOLYMER, JAPAN, vol. 42, no. 5, 10 September 2021 (2021-09-10), pages 176 - 183, XP009546699
FURUTANI. MASAHIRO EL AL.: "Dismantlable Adhesives Using Cleavable Chemical Bonds Such as Disulfide Bonds", JOURNAL OF THE ADHESION SOCIETY OF JAPAN, vol. 54, no. 8, 1 August 2018 (2018-08-01), pages 302 - 309, XP093069213
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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