Title:
PRESSURE-SENSITIVE ADHESIVE AND/OR ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/100862
Kind Code:
A1
Abstract:
Provided are a pressure-sensitive adhesive and/or an adhesive having flexibility that can be improved by an external stimulus at any time, or a pressure-sensitive adhesive and/or adhesive that can form said pressure-sensitive adhesive and adhesive. Provided is a pressure-sensitive adhesive and/or adhesive that contains: a polymer that has, in the molecules thereof, an irreversibly degradable bond that is broken by an external stimulus and does not subsequently re-bond; and/or a compound that can introduce the irreversibly degradable bond to the polymer. The irreversibly degradable bond preferably includes a nitrobenzyl group.
Inventors:
MIZUNO DAISUKE (JP)
AMAMIYA KOTARO (JP)
NAKANO TAKESHI (JP)
AMAMIYA KOTARO (JP)
NAKANO TAKESHI (JP)
Application Number:
PCT/JP2022/043958
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/02
Domestic Patent References:
| WO2017191827A1 | 2017-11-09 |
Foreign References:
| CN109735280A | 2019-05-10 | |||
| US20200332161A1 | 2020-10-22 | |||
| JP2007131710A | 2007-05-31 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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