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Patent Searching and Data


Title:
PRESSURE SENSOR AND PACKAGING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/192661
Kind Code:
A1
Abstract:
A pressure sensor and a packaging method thereof. The pressure sensor comprises: a sensitive chip (10), which comprises a thin-wall part (12) and a supporting part (11) connected to the periphery of the thin-wall part, the supporting part (11) being provided with an electrode (14); a sealing element (20), which is fitted over the sensitive chip (10) and partially surrounds together with the sensitive chip (10) to form a sealing cavity (40), the sealing element (20) being provided with a through hole (21) corresponding to the electrode (14); a conductive component (30), which is provided in the through hole (21) in a sealed mode and electrically connected to the electrode (14), the conductive component (30) and the sealing element (20) being arranged in an insulating mode, and the conductive component (30) comprising a filling part (31) and a leading-out part (32) embedded in the filling part (31). By electrically connecting the conductive component (30) to the electrode (14), a lead is not adopted, the packaging size of a pressure sensor is reduced, and absolute pressure packaging is realized.

Inventors:
NIE YONGZHONG (CN)
Application Number:
PCT/CN2020/080932
Publication Date:
October 01, 2020
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
FATRI UNITED TESTING & CONTROL QUANZHOU TECH CO LTD (CN)
International Classes:
B81B7/00; B81B7/02; B81C1/00; G01L1/22
Foreign References:
CN110054141A2019-07-26
CN104773705A2015-07-15
CN110749394A2020-02-04
CN209841242U2019-12-24
CN102455233A2012-05-16
CN105021328A2015-11-04
US20130277772A12013-10-24
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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