Title:
PRINTED BOARD AND PRINTED BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/163390
Kind Code:
A1
Abstract:
In order to prevent a coating material from adhering to a component terminal via a through-via without requiring, with respect to a printed board, an additional step between a printed board manufacturing step and a step for mounting a component on the printed board, and make it possible to reduce the cost of applying a corrosion preventing coating material, the present invention is characterized by having: a step for forming a through-via penetrating a first surface and a second surface of the printed board; and a silkscreen printing step for displaying component-related information on the first surface or the second surface. The present invention is also characterized by closing the hole of the through-via in the silkscreen printing step.
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Inventors:
TOMIYAMA KIYOTAKA (JP)
SASAKI YASUSHI (JP)
MIYAZAKI HIROYOSHI (JP)
SASAKI YASUSHI (JP)
MIYAZAKI HIROYOSHI (JP)
Application Number:
PCT/JP2016/059536
Publication Date:
September 28, 2017
Filing Date:
March 25, 2016
Export Citation:
Assignee:
HITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD (JP)
International Classes:
H05K3/28; H05K3/00
Foreign References:
| JPS63131593A | 1988-06-03 | |||
| JPH05110235A | 1993-04-30 | |||
| JPH06125164A | 1994-05-06 | |||
| JPH0160571U | 1989-04-17 | |||
| JPS59189266U | 1984-12-15 | |||
| JP2004179576A | 2004-06-24 | |||
| JPH04343288A | 1992-11-30 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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