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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD ASSEMBLY AND DESIGN AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/020335
Kind Code:
A1
Abstract:
The present invention relates to a manufacturing method for a printed circuit board assembly, comprising: manufacturing a first printed circuit board, the first printed circuit board comprising one or more positioning jacks; and manufacturing a second printed circuit board, the second printed circuit board comprising one or more positioning pins extending from a first edge of the second printed circuit board, the positioning pin(s) having an essentially rectangular cross-sectional shape in the plane perpendicular to the extension direction thereof. The one or more positioning pins of the second printed circuit board are used to be inserted into the one or more positioning jacks of the first printed circuit board, respectively, and the diagonal length c of the cross-section of a positioning pin is greater than the diameter d of a positioning jack, thereby creating an interference fit between the positioning jack and the positioning pin.

Inventors:
LUO MIN (CN)
YE QING (CN)
YU XIAOPENG (CN)
MULLER ALEXANDER (DE)
HOGE FRANK (DE)
Application Number:
PCT/CN2022/111141
Publication Date:
February 23, 2023
Filing Date:
August 09, 2022
Export Citation:
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Assignee:
PHOENIX CONTACT ASIA PACIFIC NANJING CO LTD (CN)
PHOENIX CONTACT GMBH & CO (DE)
International Classes:
H05K3/36; H01R12/71; H05K1/14
Foreign References:
CN113473745A2021-10-01
CN215816477U2022-02-11
CN106028646A2016-10-12
JPH10335775A1998-12-18
US20190006777A12019-01-03
CN207354705U2018-05-11
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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