Title:
PRINTED CIRCUIT BOARD AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/233271
Kind Code:
A1
Abstract:
Provided are a printed circuit board and a fabrication method therefor. The fabrication method for the printed circuit board comprises the following steps: lamination structure design (S1), impedance design (S2), board cutting and impedance optimization design (S3), fabrication of inner layer wiring (S4), and post-processing to form a printed circuit board with a multilayer board structure (S5). According to the printed circuit board and the fabrication method therefor, by monitoring and adjusting the various factors affecting impedance values in production processes of board cutting and fabrication of inner layer wiring, difficulties in controlling inner layer impedance of printed circuit boards in a production process can be resolved, and the inner layer impedance of the printed circuit boards can be stably controlled to meet the requirement for high precision, improving high-speed signal transmission performance of the printed circuit boards, and thereby improving the impedance yield of printed circuit boards, reducing impedance rejection rates, decreasing production costs, and reducing delivery delays due to poor impedance.
Inventors:
CHENG LIUJUN (CN)
CHEN BEI (CN)
LI YANGUO (CN)
WANG HONGFEI (CN)
CHEN BEI (CN)
LI YANGUO (CN)
WANG HONGFEI (CN)
Application Number:
PCT/CN2017/120093
Publication Date:
December 27, 2018
Filing Date:
December 29, 2017
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| CN107094349A | 2017-08-25 | |||
| CN105813374A | 2016-07-27 | |||
| CN101227800A | 2008-07-23 | |||
| JP2005277258A | 2005-10-06 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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