Title:
HOLE CONNECTING LAYER MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/233272
Kind Code:
A1
Abstract:
Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises the following steps: adhering a first insulating dielectric layer (200), used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer (200) on the daughter board; adhering a second insulating dielectric layer (300), used for laminating and filling, to the first insulating dielectric layer (200) which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer (200) and a second receiving hole on the second insulating dielectric layer (300), wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer. The method can be used to satisfy a double-sided filling requirement, strengthen adhesion between two neighboring daughter boards and control movement of the hole connecting layer, thereby preventing an excessive flow of adhesive distorting the shape of the receiving holes, and ensuring that the conductive medium is not squeezed or dispersed.
Inventors:
LIAN ZEYANG (CN)
WU SEN (CN)
LI YANGUO (CN)
CHEN BEI (CN)
WU SEN (CN)
LI YANGUO (CN)
CHEN BEI (CN)
Application Number:
PCT/CN2017/120094
Publication Date:
December 27, 2018
Filing Date:
December 29, 2017
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
International Classes:
H05K3/40; H05K3/46
Foreign References:
| CN107257603A | 2017-10-17 | |||
| US20130126221A1 | 2013-05-23 | |||
| CN103348778A | 2013-10-09 | |||
| CN103517583A | 2014-01-15 | |||
| CN102843876A | 2012-12-26 | |||
| US20150029679A1 | 2015-01-29 | |||
| CN105636368A | 2016-06-01 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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