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Title:
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2000/016597
Kind Code:
A1
Abstract:
A method for manufacturing a printed wiring board having a high-density wiring and a highly-reliable connection between conductor layers even if the annealing process is omitted because a conductor circuit made of an electroplating layer excellent in crystallinity and uniform electrodepositability and formed on a base sheet and a via hole are provided. The method comprising forming an interlayer resin insulating layer on a conductor wiring forming board, making an opening for making a via hole in the interlayer resin insulating layer, forming an electroless plating layer (1008) on the interlayer resin insulating layer, applying a resist film (1003) to the layer (1008), forming an electroplating film thereon, removing the resist film, and removing the electroless plating layer by etching so as to form a conductor wiring and a via hole characterized in that the electroless plating layer (1008) serves as a cathode, the plating metal serves as an anode, and electroplating is performed intermittently while maintaining the voltage between the anode and cathode at a constant value.

Inventors:
EN HONCHIN (JP)
NAKAI TOHRU (JP)
OKI TAKEO (JP)
HIROSE NAOHIRO (JP)
NODA KOUTA (JP)
Application Number:
PCT/JP1999/005003
Publication Date:
March 23, 2000
Filing Date:
September 14, 1999
Export Citation:
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Assignee:
IBIDEN CO LTD (JP)
EN HONCHIN (JP)
NAKAI TOHRU (JP)
OKI TAKEO (JP)
HIROSE NAOHIRO (JP)
NODA KOUTA (JP)
International Classes:
C23C18/34; C25D5/18; H05K3/10; H05K3/18; H05K3/46; H05K3/00; H05K3/24; H05K3/38; H05K3/42; (IPC1-7): H05K3/18; H05K3/46; H05K1/09; C25D5/18; C23C18/34
Foreign References:
JPH0448099A1992-02-18
JPH07336017A1995-12-22
JPH08319597A1996-12-03
JPH09289375A1997-11-04
JPH01263278A1989-10-19
JPS5190475A1976-08-07
JPH07321456A1995-12-08
JPH104254A1998-01-06
JPH02238691A1990-09-20
JPH1063540A1998-03-06
JPH06112649A1994-04-22
JPH09135077A1997-05-20
JPH04174596A1992-06-22
JPH033296A1991-01-09
JPH05287583A1993-11-02
JPH09199855A1997-07-31
JPH09246730A1997-09-19
JPH09199854A1997-07-31
JPH06314883A1994-11-08
JPH06232555A1994-08-19
JPH09331155A1997-12-22
Other References:
See also references of EP 1117283A4
Attorney, Agent or Firm:
Yasutomi, Yasuo (Nishinakajima 5-chome Yodogawa-ku Osaka-shi Osaka, JP)
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