Title:
PRINTED WIRING BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/181976
Kind Code:
A1
Abstract:
This printed wiring board (1) on which an electronic component is mounted comprises: a laminate (18) including an insulating body (17), at least one inner-layer circuit pattern (12) embedded in the insulating body, and outer-layer circuit patterns (13, 16) formed respectively on the front and back surfaces of the insulating body; and a non-penetrating end-surface through hole (2) that extends, in a side surface of the laminate, from the outer-layer circuit pattern formed on the opposite side of the electronic component mounting surface toward the inner-layer circuit pattern. The end-surface through hole has a structure in which: one end thereof that is located in an inner layer of the laminate is curved and projects toward the mounting surface side; and a conductor film (22) is formed from the surface on the opposite side of the electronic component mounting surface and over the surface of said one end.
Inventors:
TODA MITSUAKI (JP)
SAITO NAOYUKI (JP)
HASEGAWA TAKUYA (JP)
SAITO NAOYUKI (JP)
HASEGAWA TAKUYA (JP)
Application Number:
PCT/JP2014/064493
Publication Date:
December 03, 2015
Filing Date:
May 30, 2014
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H05K1/11; H01L23/12; H05K3/40; H05K3/46
Domestic Patent References:
| WO2010125858A1 | 2010-11-04 | |||
| WO2008111408A1 | 2008-09-18 |
Foreign References:
| JPH07192961A | 1995-07-28 | |||
| JP2003218490A | 2003-07-31 | |||
| JP2004103859A | 2004-04-02 | |||
| JP2000196240A | 2000-07-14 | |||
| JPH1065298A | 1998-03-06 | |||
| JPH05327227A | 1993-12-10 | |||
| JPH04250695A | 1992-09-07 |
Attorney, Agent or Firm:
NAGATO, KANJI (JP)
Nagato δΎƒ 2 (JP)
Nagato δΎƒ 2 (JP)
Download PDF: