Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2006/123783
Kind Code:
A1
Abstract:
A printed wiring board capable of being highly densedly received in a housing of an electronic apparatus. A printed wiring board (40) of a preferred embodiment of the invention has a base material (1), a conductor (7) formed in a region (36) to be bent, and conductors (8, 9) formed in a region (46) not to be bent. The conductor (7) formed in the bent region (36) has an overall thickness of 1 to 30 μm, and the conductors (8, 9) formed in the non-bent region (46) has an overall thickness of 30 to 150μm.
Inventors:
TAKEUCHI KAZUMASA (JP)
TAKANO NOZOMU (JP)
YAMAGUCHI MASAKI (JP)
YANAGIDA MAKOTO (JP)
TAKANO NOZOMU (JP)
YAMAGUCHI MASAKI (JP)
YANAGIDA MAKOTO (JP)
Application Number:
PCT/JP2006/310046
Publication Date:
November 23, 2006
Filing Date:
May 19, 2006
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TAKEUCHI KAZUMASA (JP)
TAKANO NOZOMU (JP)
YAMAGUCHI MASAKI (JP)
YANAGIDA MAKOTO (JP)
TAKEUCHI KAZUMASA (JP)
TAKANO NOZOMU (JP)
YAMAGUCHI MASAKI (JP)
YANAGIDA MAKOTO (JP)
International Classes:
H05K1/02
Foreign References:
| JP2000012991A | 2000-01-14 | |||
| JP2004168942A | 2004-06-17 | |||
| JP2002353592A | 2002-12-06 | |||
| JPH057057A | 1993-01-14 | |||
| JP2004266170A | 2004-09-24 | |||
| JP2005088309A | 2005-04-07 |
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza, 1-chome, Chuo-k, Tokyo 61, JP)
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