Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/147424
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a printed wiring board in which the electrical resistance value between a reinforcing member and the ground circuit of the printed wiring board does not readily increase. This printed wiring board includes a substrate film in which a printed circuit including a ground circuit is formed on a base film, an adhesive layer formed on the substrate film, and an electroconductive reinforcing member formed on the adhesive layer, wherein the printed wiring board is characterized in that: the adhesive layer contains electroconductive particles and an adhesive resin; and a first low-melting-point metal layer is formed on the electroconductive particles, or a second low-melting-point metal layer is formed between the substrate film and the adhesive layer, or a third low-melting-point metal layer is formed between the adhesive layer and the reinforcing member.
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| JPH073661 | [Name of device] Printed circuit board |
Inventors:
HARUNA YUUSUKE (JP)
KATSUKI TAKAHIKO (JP)
HASEGAWA TSUYOSHI (JP)
TAJIMA HIROSHI (JP)
KATSUKI TAKAHIKO (JP)
HASEGAWA TSUYOSHI (JP)
TAJIMA HIROSHI (JP)
Application Number:
PCT/JP2018/004658
Publication Date:
August 16, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K1/02; H05K9/00
Foreign References:
| JP2009218443A | 2009-09-24 | |||
| JPH09198916A | 1997-07-31 | |||
| JPH06310896A | 1994-11-04 | |||
| JP2016004971A | 2016-01-12 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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