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Patent Searching and Data


Title:
PRINTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188724
Kind Code:
A1
Abstract:
This printing device: prints a solder paste onto a first board using a first mask; prints the solder paste onto a second board using a second mask; after replacement with the second mask, measures a tension of the second mask; and if it is determined, on the basis of the measured tension of the second mask, that suction of second regions positioned on both sides of a first region capable of coming into contact with the first or second board is required for plate release between the second board and the second mask, sucks the second regions.

Inventors:
MANTANI MASAYUKI
SENOO RYO
Application Number:
PCT/JP2023/001795
Publication Date:
October 05, 2023
Filing Date:
January 20, 2023
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B41F15/36; B41F15/08; B41F15/42; B41F15/44; H05K3/34
Foreign References:
JP2015100943A2015-06-04
JP2015157418A2015-09-03
JP2020116824A2020-08-06
JP2006175692A2006-07-06
JP2020138360A2020-09-03
JP2022107330A2022-07-21
Attorney, Agent or Firm:
Eikoh, P.C. (JP)
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