Title:
PROBE CARD AND METHOD FOR REPAIRING PROBE CARD
Document Type and Number:
WIPO Patent Application WO/2022/224438
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a probe card repair method for repairing a probe card in which a defect has occurred in an alignment symbol or a peripheral region thereof by using a high-reflection chip for alignment. [Solution] The present invention is provided with a probe 16 for contacting an object being inspected, a wiring substrate 14 to which the probe 16 is attached, and a high-reflection chip 4 for alignment provided to a probe installation surface 17 of the wiring substrate 14. The high-reflection chip 4 comprises a metal plate having a through-hole 41 for fixing, and has an affixing surface to be affixed to the probe installation surface 17 with an adhesive 6 interposed therebetween and a mirror-finished high-reflection surface on the other side from the affixing surface. The adhesive 6 formed on the affixing surface has a ridge 61 that extends into the through-hole 41 for fixing.
Inventors:
TOMITA YUTAKA (JP)
Application Number:
PCT/JP2021/016446
Publication Date:
October 27, 2022
Filing Date:
April 23, 2021
Export Citation:
Assignee:
JAPAN ELECTRONIC MAT CORPORATION (JP)
International Classes:
H01L21/66; G01R1/073
Foreign References:
JP2009200271A | 2009-09-03 | |||
JP2007240787A | 2007-09-20 | |||
JPH10207039A | 1998-08-07 | |||
CN208400844U | 2019-01-18 | |||
JP2008216300A | 2008-09-18 | |||
JP2008091681A | 2008-04-17 | |||
JP2007123797A | 2007-05-17 | |||
JPH0862415A | 1996-03-08 |
Attorney, Agent or Firm:
OHTSUKI Satoshi (JP)
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