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Title:
PROBER
Document Type and Number:
WIPO Patent Application WO/2019/188999
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a prober with which it is possible to reduce the influence of current leak from a chuck stage and external noise, eliminate floating capacity of the chuck stage with respect to a prober housing, and perform inspection of a semiconductor device accurately still in the form of a wafer. The problem is solved by a prober comprising: a chuck cover conductive body which includes a bottom conductor and a side conductor, wherein the chuck stage can be housed in a space enclosed by the bottom conductor and the side conductor, the chuck cover conductive body having an upper opening; an upper cover conductive body which has a through-hole allowing for passage of support conductive portions of a surface electrode probe and a back-surface electrode probe, and is sized so as to cover at least the opening of the chuck cover conductive body in plan view, even when a contact portion of the surface electrode probe is relatively moved in a wafer to be inspected during inspection; and a means for bringing the chuck cover conductive body and the upper cover conductive body into contact and electrical conduction with each other.

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JPH0476474SEMICONDUCTOR INTEGRATED CIRCUIT
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JPH0727708INSPECTING METHOD FOR DEFECT IN WAFER
Inventors:
YASUTA KATSUO (JP)
ARUGA MAMORU (JP)
Application Number:
PCT/JP2019/012536
Publication Date:
October 03, 2019
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
NIHON MICRONICS KK (JP)
International Classes:
H01L21/66; G01R1/073; G01R31/26; G01R31/28
Foreign References:
JP2013118320A2013-06-13
JP2013117476A2013-06-13
JP2000183120A2000-06-30
JP2003043079A2003-02-13
JP2004309257A2004-11-04
JP2015035577A2015-02-19
JP2005156253A2005-06-16
JPH0784003A1995-03-31
US20170292974A12017-10-12
JP2007040926A2007-02-15
JP2008101944A2008-05-01
JP2013118320A2013-06-13
Other References:
See also references of EP 3770951A4
Attorney, Agent or Firm:
SUMA Mitsuo (JP)
Download PDF:
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