Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/032510
Kind Code:
A1
Abstract:
A process for producing a semiconductor device which comprises heating a wiring board having a chip and uncured adhesive layer superposed thereon to cure the uncured adhesive layer, characterized by including a static pressing step in which before the curing, the wiring board having a chip and uncured adhesive layer superposed thereon is statically pressed at a pressure higher by at least 0.05 MPa than ordinary pressure. In the process for semiconductor device production, voids can be easily eliminated regardless of board design and the adhesive is prevented from curling up during the void-eliminating operation.

More Like This:
JP2014033100MOUNTING METHOD
WO/2023/127378ADHESIVE AGENT COMPOSITION, FILM-LIKE ADHESIVE AGENT, SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE AGENT, AND METHOD FOR PRODUCING SAME
JP4844776Electrically connectable semiconductor adhesive
Inventors:
YAMAZAKI OSAMU (JP)
ICHIKAWA ISAO (JP)
SAIKI NAOYA (JP)
Application Number:
PCT/JP2007/065418
Publication Date:
March 20, 2008
Filing Date:
August 07, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
YAMAZAKI OSAMU (JP)
ICHIKAWA ISAO (JP)
SAIKI NAOYA (JP)
International Classes:
H01L21/52; H01L21/60
Domestic Patent References:
WO2005004216A12005-01-13
Foreign References:
JP2003077953A2003-03-14
JP2001230528A2001-08-24
JP2002359264A2002-12-13
JP2005129502A2005-05-19
Other References:
See also references of EP 2063465A4
Attorney, Agent or Firm:
SUZUKI, Shunichiro (Gotanda Yamazaki Bldg. 6F13-6, Nishigotanda 7-chom, Shinagawa-ku Tokyo 31, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: FIXATION DEVICE FOR TREATMENT OF FRACTURE OF PROXIMAL PART OF FEMUR

Next Patent: IMAGE FORMING METHOD, PLATEN MANUFACTURING METHOD, ENGRAVING DEVICE, PRINTING SYSTEM, AND PLATEN MAT...