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Patent Searching and Data


Title:
PROCESS FOR PRODUCTION OF PLATING BATH, PLATING BATH, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2011/048984
Kind Code:
A1
Abstract:
As illustrated in fig. (a), multiple carbon nano-tubes (CNTs) (1) are introduced into a water-insoluble solvent (2) and dispersed in the solvent (2) by agitation. Subsequently, as illustrated in fig. (b), an aqueous metal salt solution (3) containing a metal ion is provided, the water-insoluble solvent (2) having the CNTs (1) dispersed therein is added to the aqueous metal salt solution (3), and the resulting mixture is agitated. As as illustrated in fig. (c), the water-insoluble solvent (2) is separated into two layers without being mixed with the aqueous metal salt solution (3) that is a water-soluble solution, and is positioned over the aqueous metal salt solution (3). In this state, although some of the CNTs (1) in the water-insoluble solvent (2) remain in the water-insoluble solvent (2), most of the CNTs (1) enter the aqueous metal salt solution (3) by agitation and are dispersed in the aqueous metal salt solution (3). Subsequently, the water-insoluble solvent (2) is removed, as illustrated in fig. (d). In this manner, a plating bath (4) is produced. The plating bath is free from the concerns of the contamination of impurities, and enables the production of a high-quality coating film which contains carbonaceous microparticles.

Inventors:
KIMURA TETSUYA (JP)
IDA YASUYUKI (JP)
OGAWA MAKOTO (JP)
MOTOKI AKIHIRO (JP)
Application Number:
PCT/JP2010/067921
Publication Date:
April 28, 2011
Filing Date:
October 13, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
KIMURA TETSUYA (JP)
IDA YASUYUKI (JP)
OGAWA MAKOTO (JP)
MOTOKI AKIHIRO (JP)
International Classes:
C25D15/02; C23C18/52
Foreign References:
JP2007332454A2007-12-27
JP2009179827A2009-08-13
JP2006169609A2006-06-29
JP2006027961A2006-02-02
JP4032116B22008-01-16
Attorney, Agent or Firm:
KUNIHIRO YASUTOSHI (JP)
Kunihiro Yasutoshi (JP)
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