Title:
PROCESSING APPARATUS AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/087411
Kind Code:
A1
Abstract:
A processing apparatus (100) is provided with: a tool (12) for processing a surface (51a) of a workpiece (51); a first linear motion mechanism unit (16) that moves the tool (12) in the first direction along the surface (51a) of the workpiece (51); a second linear motion mechanism unit (20) that moves the tool (12) in the second direction orthogonal to the first direction such that a distance between a leading end (12p) of the tool (12) and the surface (51a) of the workpiece (51) changes; a distance measuring unit (24) for specifying the distance between the leading end (12p) of the tool (12) and the surface (51a) of the workpiece (51); and a moving mechanism unit (28), which has the tool (12) and the distance measuring unit (24) mounted thereon, and which alternately moves the tool (12) and the distance measuring unit (24) to a specified position on a workpiece surface. With such configuration, the processing apparatus that achieves excellent cost performance and highly accurate processing of the workpiece surface is provided.
Inventors:
FUJII TAKASHI (JP)
Application Number:
PCT/JP2013/083199
Publication Date:
June 18, 2015
Filing Date:
December 11, 2013
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B23Q17/22; B23Q1/60; B23Q17/20
Foreign References:
| JP2011167787A | 2011-09-01 | |||
| JP2009006433A | 2009-01-15 | |||
| JP2008157646A | 2008-07-10 | |||
| JP2009012083A | 2009-01-22 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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