Title:
PROCESSING DATA CREATION DEVICE AND LASER CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/239702
Kind Code:
A1
Abstract:
This processing data creation device (21) comprises: an acquisition unit (21a) which acquires product data including the shape of a product; a cutting line setting unit (21b) which sets, on the basis of the product data, a contour cutting line for cutting out the outline of the product from a workpiece; and an assignment setting unit (21c) which assigns the cutting path of a laser beam to the contour cutting line and creates processing data for the product. The assignment setting unit (21c) specifies, as a reference line segment, a line segment that is parallel to a Y-axis direction and that is equal to or longer than a determination length, among line segments that exist on the left side of the contour cutting line in an X-axis direction. The assignment setting unit (21c) assigns, to the reference line segment, a final cutting path which is a path that the laser beam cuts last on the outline cutting line.
Inventors:
SUBBAIAH SIVAKUMAR (JP)
Application Number:
PCT/JP2022/019545
Publication Date:
November 17, 2022
Filing Date:
May 06, 2022
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B23K26/38; B23K26/08; B23K26/082
Foreign References:
| JP2013035056A | 2013-02-21 | |||
| JP2013094838A | 2013-05-20 | |||
| US20180099359A1 | 2018-04-12 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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