Title:
PROCESSING DEVICE AND SUBSTRATE TRANSPORT METHOD
Document Type and Number:
WIPO Patent Application WO/2022/209888
Kind Code:
A1
Abstract:
A processing device according to one embodiment of the present disclosure comprises: a pick that holds and transports a substrate; a first suction pad disposed at a position so as to come into contact with the substrate flexed into a concave shape in the pick; a second suction pad disposed at a position so as to come into contact with the substrate flexed into a convex shape in the pick; a pressure sensor that detects the pressure in a first suction path connected to the first suction pad and the pressure in a second suction path connected to the second suction pad; and a control unit that controls suction actions performed by the first suction pad and the second suction pad on the basis of detection values from the pressure sensor.
Inventors:
OBIKANE TADASHI (JP)
KAGAMI FUMITO (JP)
ARAI KAORI (JP)
KAGAMI FUMITO (JP)
ARAI KAORI (JP)
Application Number:
PCT/JP2022/011821
Publication Date:
October 06, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677
Domestic Patent References:
| WO2012014442A1 | 2012-02-02 |
Foreign References:
| JP2014135390A | 2014-07-24 | |||
| JP2013038327A | 2013-02-21 | |||
| KR20090026831A | 2009-03-16 | |||
| CN210403691U | 2020-04-24 | |||
| JPH06247507A | 1994-09-06 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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