Title:
PROCESSING METHOD FOR EARPAD STRUCTURE, EARPAD STRUCTURE AND EARPHONE
Document Type and Number:
WIPO Patent Application WO/2023/098062
Kind Code:
A1
Abstract:
Disclosed in the present invention are a processing method for an earpad structure, the earpad structure, and an earphone. The processing method for the earpad structure comprises the following steps: processing and forming an earpad body by means of a mold, wherein the formed earpad body is provided with a mounting channel, the mounting channel is configured to be sleeved outside the in-ear body of the earphone, and an accommodating cavity is formed in the wall part of the mounting channel; filling the accommodating cavity with a filler having fluidity; and sealing the accommodating cavity to obtain an earpad structure finished product. In this way, the earpad structure is obtained. When the exterior of the earpad body is in contact with an ear concha, the accommodating cavity can be squeezed to be deformed, and the accommodating cavity being deformable also enables the part of the in-ear body in contact with a human ear to be kept tightly attached to the human ear.
Inventors:
TANG WEI (CN)
ZHANG SHUAI (CN)
ZHAO CHANGHONG (CN)
WANG JUNWEI (CN)
ZHANG SHUAI (CN)
ZHAO CHANGHONG (CN)
WANG JUNWEI (CN)
Application Number:
PCT/CN2022/102558
Publication Date:
June 08, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
GOERTEK TECH CO LTD (CN)
International Classes:
H04R1/10; H04R31/00
Foreign References:
| CN114040315A | 2022-02-11 | |||
| CN215529258U | 2022-01-14 | |||
| CN211982107U | 2020-11-20 | |||
| CN211509275U | 2020-09-15 | |||
| CN208971742U | 2019-06-11 | |||
| US20180160210A1 | 2018-06-07 | |||
| TWM266668U | 2005-06-01 | |||
| CN106210963A | 2016-12-07 | |||
| CN207802311U | 2018-08-31 | |||
| US20160301999A1 | 2016-10-13 |
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